The digital twin of Silicon Box production line
Silicon Box, an advanced semiconductor packaging company specialising in cutting-edge chiplet integration services, has secured US$200 million in a Series B fundraising round, bringing its valuation to over US$1 billion.
The capital came from the company founders, as well as other strategic investors, including BRV Capital, Event Horizon Capital, Maverick Capital, Prasedium Capital, Tata Electronics, TDK Ventures, and UMC Capital.
The money will be used to expand production in its advanced US$2-billion packaging factory in Singapore, which has been in mass production for early customers since October 2023, shortly after its grand opening on July 20, 2023.
Current semiconductor chips are hitting a wall in scalability, limited by conventional packaging approaches. Meanwhile, chip designers’ development and manufacturing costs have become cost-prohibitive except for the most well-funded players, leaving the industry bottlenecked and consumers paying high prices.
Founded in 2021 by semiconductor design and packaging industry titans Dr Sehat Sutardja and Weili Dai and CEO Dr Byung Joon Han, Silicon Box aims to bring affordable, high-performance, power-optimised, scalable solutions that enable next-gen large language models (LLM), generative AI, automotive, data centres and mobile computing.
The startup enables chiplet architecture, allowing chip designers freedom from the constraints of a single, monolithic chip for processing. By leveraging multiple smaller chips interconnected in a single package, chip designers can create the equivalent of a “system-on-a-chip” (SoC) in a package.
Chiplets enable dramatically better performance, smaller device sizes, and better device reliability. Most importantly, they make it easier for foundries and chip designers to collaborate to build chips for the most cutting-edge applications.
The company claims its solutions are more reliable and cost-effective due to the standardised packaging process for the shortest chiplet-to-chiplet interconnection, reducing the manufacturing costs for high-performance devices by up to 90 per cent, with better thermal and electrical performance. This is especially crucial for the high-growth AI accelerator market.
Also Read: How Infineon aims to build better semiconductors with the help of Singapore startups
“We are leading the pack to bring high performance, power-optimised, affordable, and scalable solutions that enable next-gen large language models (LLM), generative AI, automotive, data centres, and mobile computing globally,” said CEO Joon Han. “Our state-of-the-art factory and advanced panel-level packaging are delivering a solution to scale high-growth markets, such as AI accelerators, to the masses.”
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